<?xml version="1.0" encoding="utf-8" standalone="yes"?><rss version="2.0" xmlns:atom="http://www.w3.org/2005/Atom"><channel><title>Coverlay on PCB RFQ Blog</title><link>https://blog.pcbrfq.com/tags/coverlay/</link><description>Recent content in Coverlay on PCB RFQ Blog</description><generator>Hugo -- gohugo.io</generator><language>en-us</language><copyright>© 2026</copyright><lastBuildDate>Wed, 20 May 2026 00:00:00 +0000</lastBuildDate><atom:link href="https://blog.pcbrfq.com/tags/coverlay/index.xml" rel="self" type="application/rss+xml"/><item><title>Polyimide Flex PCBs — Chemistry, Coverlay, and Why Flexible Solder Mask Is Not the Same Thing</title><link>https://blog.pcbrfq.com/posts/polyimide-flex-coverlay-solder-mask/</link><pubDate>Wed, 20 May 2026 00:00:00 +0000</pubDate><guid>https://blog.pcbrfq.com/posts/polyimide-flex-coverlay-solder-mask/</guid><description>&lt;p&gt;Flex PCB specifications are among the most frequently underspecified documents in electronics procurement. Buyers write &amp;ldquo;flex PCB, polyimide base&amp;rdquo; and assume the supplier will fill in the rest correctly. Sometimes they do. Often they do not — and the failure mode is a board that cracks, delaminates, or develops intermittent opens after a few thousand flex cycles.&lt;/p&gt;
&lt;p&gt;Understanding why polyimide behaves the way it does, and why the protective layer choices matter as much as the base material, is the foundation of a correct flex PCB specification.&lt;/p&gt;</description></item></channel></rss>