<?xml version="1.0" encoding="utf-8" standalone="yes"?><rss version="2.0" xmlns:atom="http://www.w3.org/2005/Atom"><channel><title>Engineering on PCB RFQ Blog</title><link>https://blog.pcbrfq.com/tags/engineering/</link><description>Recent content in Engineering on PCB RFQ Blog</description><generator>Hugo -- gohugo.io</generator><language>en-us</language><copyright>© 2026</copyright><lastBuildDate>Tue, 19 May 2026 00:00:00 +0000</lastBuildDate><atom:link href="https://blog.pcbrfq.com/tags/engineering/index.xml" rel="self" type="application/rss+xml"/><item><title>Why FR4 High-Tg Behaves Differently — The Chemistry Behind Cross-Linking</title><link>https://blog.pcbrfq.com/posts/fr4-high-tg-cross-linking/</link><pubDate>Tue, 19 May 2026 00:00:00 +0000</pubDate><guid>https://blog.pcbrfq.com/posts/fr4-high-tg-cross-linking/</guid><description>&lt;p&gt;When buyers specify FR4 High-Tg on an RFQ, they often do so because a datasheet or engineer told them to. Fewer understand &lt;em&gt;why&lt;/em&gt; it behaves differently from standard FR4 — and why that difference matters when a board heats up under load, goes through lead-free soldering, or operates in a demanding environment.&lt;/p&gt;
&lt;p&gt;The answer lies not in the glass fibres or mineral fillers, but in the epoxy resin chemistry itself.&lt;/p&gt;</description></item></channel></rss>